Alumina Ceramic Substrate
Peculiarity
Application：Widely used in electronic component heat dissipation substrates, high-power circuit boards in the automotive industry, copper-clad boards, printers,LED.lighting, and communication devices.
Material Grades：92%, 96%, 98%, 99%, 99.5% Alumina.
Processing Methods：Laser scribing, mold stamping.
Thickness Range：Minimum 0.2mm, maximum 3.0mm.
Dimensions：Maximum length 420mm, maximum width 240mm.
Hole Diameter Range：Minimum hole diameter φ0.07mm.
Advantages：
1、Excellent thermal conductivity and thermal shock resistance；
2、Superior surface properties, flatness, and high dimensional accuracy；
3、Corrosion resistance；
4、Corrosion resistance；
5、High insulation performance, low dielectric constant, and low dielectric loss；
6、Excellent mechanical strength.
