Electrostatic Chuck
Peculiarity
Application：Photolithography process, etching process,thin film deposition process, ion implantation process；
Features：
1、Surface ceramic materials: aluminum nitride ceram ics, aluminum oxide ceramics；
2、Electrode materials: Usually, metal materials such as copper and aluminum are used. A layer of corrosion-resistant and high-temperature-resistant metal or alloy will also be plated；
Size：It is applicable to 4-inch, 6-inch, 8-inch, and 12-inch wafers。
